| PART |
Description |
Maker |
| AE590PNB |
Outgassing Compliant Power Inductors
|
Coilcraft lnc.
|
| AE486PYA222MSZ AE486PYA801MSZ |
Outgassing Compliant Power Inductors
|
Coilcraft lnc.
|
| AE425PJB |
Outgassing Compliant Power Inductors
|
Coilcraft lnc.
|
| AE336RAD51NSZ AE336RAD39NSZ AE336RAD6N2JSZ AE336RA |
Outgassing Compliant Chip Inductors
|
Coilcraft lnc.
|
| AE439RAT19NSZ AE439RAT13NSZ AE439RAT2N5KSZ AE439RA |
Outgassing Compliant Air Core Inductors
|
Coilcraft lnc.
|
| X2864HJ-70 X2864BPI-18 X2864HJ-90 X2864BGM-12 X286 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, SOT23, IND TEMP, GREEN, 1.8V(SERIAL EE)
32M CONFIG FLASH, 44 PLCC, IND(FPGA)
10 MHZ, 8 LAP, IND TEMP(FPGA)
25NS, 24 SOIC, IND TEMP(EPLD)
10MS, 8 TSSOP, EXT TEMP, 2.7V(SERIAL EE)
DIE SALE,1.8V, 11MIL(SERIAL EE)
10MHZ, 8 PDIP, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
10MHZ, 44 TQFP, COM TEMP(FPGA)
128Kx8 EEPROM
20NS,CERDIP,883C; LEV B FULLY COMPLIANT(EPLD)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10 MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) x8的EEPROM
10MHZ, 20 PLCC, IND TEMP(FPGA) x8的EEPROM
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
|
ITT, Corp.
Pericom Technology (Shanghai) CO., Ltd.
Diodes, Inc.
Electronic Theatre Controls, Inc.
|
| ISC1812BN8R2K ISC1812ES4R7K ISC1812BN1R5J ISC1812E |
General Fixed Inductor, IND,POWDERED IRON,8.2UH,10% TOL,10% -TOL,1812 CASE
General Fixed Inductor, 1 ELEMENT, 4.7 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1812, HALOGEN FREE AND ROHS COMPLIANT
General Fixed Inductor, IND,POWDERED IRON,1.5UH,5% TOL,5% -TOL,1812 CASE
General Fixed Inductor, IND,FERRITE,120UH,5% TOL,5% -TOL,1812 CASE
General Fixed Inductor, IND,FERRITE,560UH,5% TOL,5% -TOL,1812 CASE
General Fixed Inductor, IND,FERRITE,270UH,10% TOL,10% -TOL,1812 CASE
General Fixed Inductor, IND,POWDERED IRON,22UH,5% TOL,5% -TOL,1812 CASE
ISC-1812 Wirewound, Surface Mount, Molded, Shielded Inductors
IND CHIP SHLD/MLD 330NH 5% 25.2MHZ 30Q-FCTR 394MA 1812 - Bulk
IND CHIP SHLD/MLD 150NH 20% 25.2MHZ 30Q-FCTR 491MA 1812 - Tape and Reel
General Fixed Inductor, IND,POWDERED IRON,10UH,10% TOL,10% -TOL,1812 CASE
|
Vishay Dale
|
| AM7203-25DC AM7203-25JC AM7203-25PC AM7203-25RC AM |
x9 Asynchronous FIFO X9热卖异步FIFO
55NS, TSOP, IND TEMP(FLASH) X9热卖异步FIFO
70NS, VSOP,IND TEMP(FLASH) X9热卖异步FIFO
1M (64K X 16), 5V FLASH, COM TEMP(FLASH) X9热卖异步FIFO
55NS, PLCC, TOP BOOT, IND TEMP,GREEN PKG(FLASH)
90NS, TSOP, IND TEMP(FLASH)
70NS, TSOP, COM TEMP(FLASH)
55NS, VSOP, IND TEMP, GREEN(FLASH)
70NS, PLCC, IND TEMP(FLASH)
55NS, TSOP, IND TEMP, GREEN(FLASH)
x9AsynchronousFIFO
|
Rochester Electronics, LLC
Ecliptek, Corp.
|
| IHM2PM100K IHM2PM330K IHM2EB332K |
General Fixed Inductor, IND,FERRITE,10UH,10% TOL,10% -TOL
General Fixed Inductor, IND,FERRITE,33UH,10% TOL,10% -TOL
General Fixed Inductor, 1 ELEMENT, 3300 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, ROHS COMPLIANT
|
Vishay Dale
|
| PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp.
TE Connectivity, Ltd.
|
| PUMA67F16000I-25 PUMA67F16000M-15 PUMA67F16000M-20 |
200NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
250NS, PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM)
200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
150NS, PDIP, IND TEMP(EEPROM)
150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM) X32号，闪存EEPROM模块
x32 Flash EEPROM Module X32号，闪存EEPROM模块
|
NXP Semiconductors N.V.
|
| AM3064-70/BZC AM3064-50GI175 AM3064-50JC068 AM3090 |
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
DIE SALE, 2.7V, 7 MIL(BIOS FLASH)
10MS, 8 SAP, IND, ROHS-B, 2.7V(BIOS FLASH)
8-SOIC,AUTO TEMP,2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, EXT TEMP, GREEN,2.7V(SERIAL EE)
10MS, 8 TSSOP, INT TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, INT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN,2.7V(SERIAL EE)
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
Field Programmable Gate Array (FPGA) 现场可编程门阵列（FPGA
10MS, 8 SOIC, INT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 PDIP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
|
Stackpole Electronics, Inc.
Ecliptek, Corp.
Analog Devices, Inc.
Glenair, Inc.
|
|
